We see that UG575 mentions the BGA nominal dia of 0. Dynamic IOD Interface Training. // Documentation Portal . pdf either. If so, could any pin act as a synchronized reset input? Open, closed, and transaction based pre-charge controller policy. For Zynq UltraScale (as shown by ashishd), see UG1075. Can you please suggest what is the recommended PCB pad size for them? Also, We are using via-in-pad structure. R e c o m m e n d e d O p e r a t i n g C o n d i t i o n s. Using the buttons below, you can accept cookies, refuse cookies, or change. Whether you are designing a state-of-the art, high-performance networking application requiring the highest capacity, bandwidth, and performance, or looking for a low-cost, small footprint FPGA to take your software-defined technology to. You can contact Amanang Child Development Center UG839 by phone using number 0772 958281. vhd がアップデートされました。 『UltraScale および UltraScale+ FPGA パッケージおよびピン配置ユーザー ガイド』 (UG575) の第 1 章「パッケージ概要」の「ダイ レベルでのバンク番号の概要」を参照してください。 1) . com 注 : zip ファイルには、txt および csv 形式の ascii パッケージ ファイルが含まれます。このファイル形式は、 ug575 で説明されています。 This web page provides the pinout files for the UltraScale and UltraScale+ packages, which are used in Xilinx FPGA devices. このユーザー ガイド. refer the attached images for Xilinx & Si5391(PLL planned to use) LVPECL termination requirements. You also see the available banks in ug575, page63, figure 1-16. MEMORY INTERFACES AND NOC. Can you please check and let me know the correct link? If a single-ended clock is connected to the P-side of a differential clock pin pair, the N-side cannot be used as another single-ended clock pin—it can only be used as a user I/O. only drawing a few watts. pdf either. Therefore, it remains a challenge for Xilinx to predict the power requirements of a given FPGA when it leaves the factory. 0) December 10, 2013 Send Feedback 46 Chapter 10 Thermal Management Strategy Introduction As described in this section, Xilinx relies on a multi-pronged approach to consuming less power and dissipating heat for systems using UltraScale devices. Xilinx does not provide OrCAD schematic symbols. In some cases, they are essential to making the site work properly. ug575 Zynq TRM, page 231 table 7-4. Programmable System Integration. Loading Application. (XAPP1282)6. Are they marked in ug575-ultrascale-pkg-pinout. Usually solder-mask is 4mil larger that the solder land. If the IO pin is in a HP. Device : xcku085 flva1517 vivado version: 2018. PCIe blocks are present on top and bottom of the SLR. [email protected]/s. Dragonboard Magnesium Oxide Board (MgO) is a lightweight alternative to poured concrete. 18) April 22, 2022 Chapter 4: Mechanical Drawings UBVA368 Flip-Chip, Fine-Pitch BGA (XCAU10P and XCAU15P) X-Ref Target - Figure 4-1 Figure 4-1: Package Dimensions for UBVA368 (XCAU10P and XCAU15P) ug575_ch5_030122 Send Feedback MSL is a number between 1 and 7. (XAPP1188) FPGA Configuration from SPI Flash Memory using a Microprocessor. My questions: 1. On the KCU116 board, the User Guide (UG1239) shows that the FPGA is a XCKU5P-2FFVB676E and that a clock source called EMCCLK is routed to pin-N21. Given that BK22 is unconnected in the Figure 3-163 device diagram of UG575, it seems that the user guide UG1302 (even v1. What is the meaning of this table？. Product Application Engineer Xilinx Technical SupportLoading Application. So if you look at the package overview section in UG575 you see the conceptual diagram of each VUP device. Regards, Cousteau. R evision His t ory. Share. e. com. I find it easiest to find it in the gt wizard in vivado. Hello @hpetroffxey5 . I suppose the XCAU25P is the same as XCKU3P, so please refer to the KU3P in the xlxs. Hi, We are using Tandem PCIe for VU9P (with Migration Support for VU125 device) in B2104 Package. It is market as PC44CEM0015 F1117188A The marking is in bright white and easily readable. UG575 suggested to use external shunt resistor for proper operation, But Si5391 PLL circuit recommendation mentioned that Shunt resistors to ground or series resistors should NOT be added. Best regards, Kshimizu . tzr is for Icepak and pdml is for Flotherm thermal tool import. . Resources Developer Site; Xilinx Wiki; Xilinx Github UG575 (v1. Programmable Logic, I/O and Packaging Programmable Logic, I/O & Boot/Configuration Kintex UltraScale Knowledge. Product Application Engineer Xilinx Technical SupportI've been trying to do so, but the tool automatically places a BUFG in the middle and the placement fails. QUALITY AND RELIABILITY. (on time) 4h 11m total travel time. Loading Application. BR. The format of this file is described in UG1075. 66 mm) in UG1075 is applicable to the XCZU43DR part as well. From ug575: Expand Post. Like Liked Unlike Reply 1 like. A single PCIe4 Integrated Block is capable of Gen3x16, but this requires 4 adjacent GT Quads. OTHER INTERFACE & WIRELESS IP. Best regards, Kshimizu. Best regards, Kshimizu . The following is a description for how to modify the pinouts for different devices. When used as regular I/O, global clock input pins can be configured as any single-ended or differential I/O standard. Thank you! Look at the Device Diagrams section of UG575 (Packaging and Pinouts) for your device. ,Ltd. 6) August 26, 2019 11/24/2015 1. Up to 1. UltraScale Architecture SelectIO Resources 6 UG571 (v1. High DSP and block RAM-to-logic ratios, and next generation transceivers are combined with low-cost packaging to enable an optimum blend of capability for these applications. Resources Developer Site; Xilinx Wiki; Xilinx Githubヒートシンク設計の際は、『UltraScale および UltraScale+ FPGA パッケージおよびピン配置ユーザー ガイド』 (UG575) および『Zynq UltraScale+ デバイス パッケージおよびピン配置ユーザー ガイド』 の機械的図面でダイのサイズとスティフナー リングの開口部を確認し. Date V ersion Revision. We would like to show you a description here but the site won’t allow us. Resources Developer Site; Xilinx Wiki; Xilinx Github Bank Diagram is in the UG575 regarding the XCAU25P-FFVB784. So if you look at the package overview section in UG575 you see the conceptual diagram of each VUP device. Expand Post. . Loading Application. pdf. Could you please provide the datasheet or specs for the maximum operating temperature (i. This helps to achieve timing closure of the design. 使用的是KCU1500开发板，外接时钟是差分时钟模式，而我配置DDR4 SDRAM（MIG） 如下图使用No Buffer模式： 请问这种模式应该如何连接时钟？Bank Diagram is in the UG575 regarding the XCAU25P-FFVB784. 11), but bear a rectangle there - like a country of origin and some numbers below. Article Details. AMD offers a comprehensive multi-node portfolio to address requirements across a wide set of applications. For a quick estimate you can look at bank numbers, usually they are consecutive for the same column with a gap between columns but there is no number gap for the SLR split. See UG575, UltraScale Architecture Packaging and Pinouts User Guide for more information. I use SMBALERT as an indicator signal on my board, and in some cases, I have noticed that during FPGA startup, where the SMBALERT signal is pull. Is the 6mil shown here a mistake?PCIe Reset on VU11P on bank 65. R evision His t ory. 11). @kimjaewonim98 . Introduction to UltraScale and UltraScale+ FPGAs Packaging and Pinouts: This section describes the packages and pinouts for the UltraScale architecture-based FPGAs in various organic flip-chip 0. 6) and X0Y0 for VU125 (as per Figure 1-53 in UG575 v1. 5W Power Dissipation (TA = 60°C, 200 LFM, No Heat. 8mm ball pitch. For UltraScale and UltraScale+, see UG575. I believe the specific part you are using is the XCKU040-2FFVA1156E from the KCU105 home page, so I recommend looking through that UG with that part in mind. Resources Developer Site; Xilinx Wiki; Xilinx Github 注 : zip ファイルには、txt および csv 形式の ascii パッケージ ファイルが含まれます。このファイル形式は、ug575 で説明されています。 Note: The zip file includes ASCII package files in TXT format and in CSV format. The scheduling of PHY commands is automatically done by the memory controller and tHi @dennis. Standard 2075, Edition 2 Edition Date: March 05, 2013 ANSI Approved: August 04, 2023 USD. See UG575, UltraScale Architecture Packaging and Pinouts User Guide for more information. We would like to show you a description here but the site won’t allow us. UG575 (v1. Selected as Best Selected as Best Like Liked Unlike 1 like. GitLab. Programmable Logic, I/O and Packaging. tzr and pdml format . My specific concern is the height from the seating plane (dimension A). Hello, I am currently designing a heatsink solution (heatsink + thermal pad) for a FPGA Ultrascale with a lidless package (XCKU035 FBVA900). MSL is a number between 1 and 7. This site uses cookies from us and our partners to make your browsing experience more efficient, relevant, convenient and personal. Resources Developer Site; Xilinx Wiki; Xilinx Github; Support Support CommunityUltraScale Architecture GTH Transceivers 6 UG576 (v1. Preview. It seems there is a discrepancy between the Ultrascale selection guide for XCKU095 there is written 650 HP I/O and 52 HR I/O for the B1760 package and in the UG575 page 25 Table 1-4 FFVB1760 package 598 HP I/O and 52 HR I/O. Share. GTH transceivers in A784, A676, and A900 packages support data rates up to 12. . . The format of this file is described in UG1075. The web page is a forum thread from Xilinx users who discuss the topic of UG575 v1. 8. -----Expand Post. UltraScale Architecture SelectIO Resources 6 UG571 (v1. I find much good reading about this in chapter-4 of ug583 and starting on page-31 of ug575. We have planned to use Kintex ultrascale FPGA: XCKU060-2FFVA1157i in our design. ) along with any thermal resistances or power draw numbers you may have. 3 (Cont’d) UG575 (v1. The package file for XCKU5P-2FFVB676E shows that pin-N21 is in HP-bank #65 and has designation, IO_L24P_T3U_N10_EMCCLK_65. Loading Application. In this case you can see we only support HP banks. Interface calibration and training information available through the Vivado hardware manager. Is the 6mil shown here a mistake?PCIe Reset on VU11P on bank 65. // Documentation Portal . 5V Output Voltage n 4A DC, 5A Peak Output Current Each Channel n Up to 5. The Radeon Pro 575 is a professional mobile graphics chip by AMD, launched on June 5th, 2017. 8mm ball pitch. 0. I just realised that the package XCKU060 FFVA1517 also has MGTAVCC_RN,MGTAVTT_RN,MGTVCCAUX_RN pins. Loading Application. 6) August 26, 2019 11/24/2015 1. I am trying to make a hardware design with ultrascale xcku035-ffva1156 FPGA. Community Reviews (0) Feedback? No community reviews have been submitted for this work. FPGA Bank Columns. Article Number. 6. I dont find in ug575. POWER & POWER TOOLS. No - although some would refer you to the GSR (Global Set/Reset) pin of the STARTUPE3 primitive - see page 118 of UG570(v1. Product Application Engineer Xilinx Technical Support Loading Application. there is no version of Virtex Ultrascale+ that supports HD banks. Meaning, I cannot find "Quad 231" there. DragonBoard USA Announces Update to UL Floor and Ceiling Assembly G575. Child care and day care. Expand Post. March 10, 2021 at 5:57 PM. 8mm ball pitch. Does Xilinx provide OrCAD symbol files ? If not, how to use the ASCII Pinout Files. . 5Gb/s. On the KCU116 board, the User Guide (UG1239) shows that the FPGA is a XCKU5P-2FFVB676E and that a clock source called EMCCLK is routed to pin-N21. 嵌入式开发. 8. This question is for testing whether or not you are a human visitor and to prevent automated spam submissions. 18) April 22, 2022 Chapter 4: Mechanical Drawings UBVA368 Flip-Chip, Fine-Pitch BGA (XCAU10P and XCAU15P) X-Ref Target - Figure 4-1 Figure 4-1: Package Dimensions for UBVA368 (XCAU10P and XCAU15P) ug575_ch5_030122 Send Feedback ザイリンクス コンフィギュレーション ソリューションを使用する際は、次の資料を参照してください。日本語版は、最新. junction, case, ambient, etc. Selected as Best Selected as Best Like Liked Unlike Reply 3 likes. 000020638. Search the PIN number in this file. If the IO pin is in a HD bank, then use the VCCO value and Tables 3-1 and 3-2 in UG571(v1. See UG575, UltraScale Architectu re Packaging and Pinou ts User Guide f or more information. UltraScale Architecture Migration Table Footprint Artix® UltraScale+™ Kintex® UltraScale™ Kintex UltraScale+ Virtex® UltraScale Virtex UltraScale+ AU7P AU10P AU15P AU20P AU25P KU025 KU035 KU040 KU060 KU085 KU095 KU115 KU3P KU5P KU9P KU11P KU13P KU15P VU065 VU080 VU095 VU125 VU160 VU190 VU440 VU3P VU5P VU7P. Toronto: Dundurn Group, c2001. Solution. TXT) or (. 如果是，烦请一同推荐；. Thanks! AliA) and then markings that are not explained even by the latest UG575 (v1. Other IO lines between the FPGA and the flash devices need to be multiplexed depending on which flash is enabled. only drawing a few watts. You can refer to UG575 to check which ports can be used as GT's reference clock. We would like to show you a description here but the site won’t allow us. . DMA 使用之 ADC 示波器(AN706) 26. **BEST SOLUTION** Hi @dragonl2000lerl3,. Up to 9 Extension sites with high speed connectors. . In some cases, they are essential to making the site work properly. . >>The top-of-the-line Core i9-13900KS supports x16+x4 or x8+x8+x4. 0 mm pitch BGA packages. GTH transceivers in A784, A676, and A900 packages support data rates up to 12. Loading Application. Hi @andremsrem2,. UG570 UltraScale Architecture Configuration UG575 UltraScale and UltraScale+ FPGAs Packaging and Pinouts UG571 UltraScale Architecture SelectIO UG576 UltraScale Architecture GTH Transceivers UG572 UltraScale Architecture Clocking Resources UG579 UltraScale Architecture DSP SliceFrom UG575, we know how to put the pins in continuous 3 banks, but there's no column information for each bank. BOOT AND CONFIGURATION. Hello, I was trying to find some thermal specs for the XCKU115-FLVA1517 Ultrascale FPGA module but am not having any luck. Loading Application. It includes diagrams, tables, and. I want to use 5 DDR4 component memories (x16 type) and i need to connect them to 3 HP banks (44,45,46) because of resource availability. RF & DFE. g. All other packages listed 1mm ball pitch. GTH transceivers in A784, A676, and A900 packages support data rates. // Documentation Portal . Resources Developer Site; Xilinx Wiki; Xilinx GithubDoes Maximum PCB solder land (L) diameter (see attached pic for UG575) really refers to the maximum value? Is there a typical value? Which value is it recommended to use? 3. 6V to 5. UltraScale Architecture Configuration 3 UG570 (v1. Multiple integrated PCI Express ® Gen3 cores. Note: The zip file includes ASCII package files in TXT format and in CSV format. 12) ) Each I/O bank has 52 pins that can be used for IO (see page-151 of UG571) Total HP and HR IO is (from 3) and 4)) equal to 520 pins and each has its own BITSLICE_RX_TX that can be configured as either ODELAYE3 or IDELAYE3. 17)) that you can access directly from your HDL. "X1 Y20" Column Used: e. All banks in the same SLR and column in those diagrams are in the same "I/O bank column". 1 answer. (UG575) v1. There are Four HP Bank. 1) August 16, 2018 09/15/2015 1. OLB) files? 1. Packages with a Level 1 MSL rating are the least sensitive to moisture, and packages with larger numbers are relatively more sensitive to moisture. . It seems the value for M is too high (UG575, table 8-1). Product Application Engineer Xilinx Technical Support要找一下 kintex-ultrascale系列器件的BANK 0 pin脚配置说明；请告知具体在哪一份文档？. 12) to determine available IOSTANDARDs. 嵌入式开发. 1) September 14, 2021 11/24/2015 1. 13) September 27, 2019. I have read in ug575 some recommendations about heatsink attachment for lidless package. 5Gb/s. // Documentation Portal . Number of pages 366 ID Numbers Open Library OL5622879M LCCN 68033368. デバイス資料 (ザイリンクス) 『Zynq-7000 SoC テクニカル リファレンス マニュアル』 (UG585) は、Zynq SoC のアーキテクチャ、機能、および制御およびステータス レジスタの詳細な説明を含む総合的なユーザー ガイド (1700ページ以上) です。. Using the buttons below, you can accept cookies, refuse cookies. ug585-Zynq-7000-TRM. I/O Features and Implementation. UG575 adalah bandar slot teraman dengan bonus deposit, freebet / freechip tanpa deposit, promo anti rungkat, bonus rebate mingguan, bonus member baru, deposit pulsa tanpa potongan, perfect attendant (absensi mingguan), bonus referral, bonus happy hour, extra bonus TO (TurnOver) bulanan, cashback mingguan, winrate tertinggi, proses. 28 says that the data pins and chip-select are dedicated for UltraScale whereas the corresponding pins in a 7series device are multi-function (UG475, p. . Symbol Description 1, UltraScale Architecture Configuration User Guide UG570 (v1. 2 Note: Table, figure, and page numbers were accurate for the 1. Resources Developer Site; Xilinx Wiki; Xilinx GithubUltraScale Architecture GTH Transceivers 6 UG576 (v1. The vivado 2015. Download the package file (matching your part) which is a text file. Selected as Best Selected as Best Like Liked Unlike. Canadian Army. UG575 . You also see the available banks in ug575, page63, figure 1-16. UltraScale FPGA BPI Configuration and Flash Programming. PROGRAMMABLE LOGIC, I/O & BOOT/CONFIGURATION. Bank 47 and 48 are okay if it places the MIG IP. 1 Removed “Advance Spec ification” from document ti tle. 7. Ex. 85V or 0. Best regards, Kshimizu . + Log in to add your community review. For example, the VU9P has GTYs that use bank 123. All Answers. Specified as each individual output channel at TA = 25°C, VIN1 = VIN2 = 12V, unless otherwise noted per the typical application shown in. Resources Developer Site; Xilinx Wiki; Xilinx GithubLoading Application. In your design guide it said that the GTH bank's supply can be left open if the bank is unused. 5Gb/s. UG575 table 10-1 page 441 OR try our package thermal data query tool and enter your part. According to the user guide UG575, the SMBALERT pin is an optional PMBus alert signal, when Low, indicates a system fault . XDC file shows that C0_SYS_CLK_clk_p and C0_SYS_CLK_clk_n are connected to FPGA pins H22 and H23. riester@sensovation. // Documentation Portal . Expand Post. I am looking for the diagram for ultrascale+ Artix FPGAs. I see the package in ug575. You can contact the company at 0772 958281. 感谢！. Many times I have purchased in open market. 1. tyhero (Member) 5 years ago **BEST SOLUTION** Yes, the ports are not right. Changing it in the Zynq customize IP window, in Interrupts/Fabric Interrupts/PL-PS Interrupt Ports/IRQ_F2P[15:0], only toggles it on and off but the resulting port is always [0:0]. See UG575, UltraScale Architecture Packaging and Pinouts User Guide for more information. I suppose the XCAU25P is the same as XCKU3P, so please refer to the KU3P in the xlxs. The format of this file is described in UG575. 1 and vivado 2015. Virtex UltraScale+ FPGA Data Sheet: DC and AC Switching Characteristics DS923 (v1. The scheduling of PHY commands is automatically done by the memory controller and t4. A reply explains that version 1. 14) recommend a slightly different numbers (see attached picture) for our 1mm pitch device. Can anyone verify this for me please? Thank you, Joe. Also, here is an AR for your reference. I have followed pG150,UG575 etc for understanding the various constraints and followed the same. 3 IP name: IBERT Ultrascale GTH version: 1. It seems the value for M is too high (UG575, table 8-1). See UG575, UltraScale Architecture Packaging and Pinouts User Guide for more information. UG475 is a user guide that provides detailed information on the pinout and package specifications of the 7 series FPGAs from Xilinx. G576 explains how to select the reference clock (see page 32). > I found a newer version of the document and it had the device I am usingPackaging. • If all of the Quads in a power supply group are not used, the associated power pins can be left unconnected or tied to GND (unless the RCAL circuit is in that Quad). hello, Regarding soldering of the XCKU060-2FFVA1517E (used in one of our projects): ug1099 (v1. My specific concern is the height from the seating plane (dimension A). All Answers. 12. Could you please provide the datasheet or specs for the maximum operating temperature (i. It seems there is a discrepancy between the Ultrascale selection guide for XCKU095 there is written 650 HP I/O and 52 HR I/O for the B1760 package and in the UG575 page 25 Table 1-4 FFVB1760 package 598 HP I/O and 52 HR I/O. 基于 DAC 模块的 Scatter/ Gather DMA 使. A Virtex Ultrascale XCVU065, that has no speed grade and temperature range marking, but it does not even bear a marking forUG575. and is protected under U. I am trying to make a hardware design with ultrascale xcku035-ffva1156 FPGA. AMD Virtex UltraScale+ XCVU13P. Loading Application. A single PCIe4 Integrated Block is capable of Gen3x16, but this requires 4 adjacent GT Quads. For example, I don't meet timing and I want to force the place of an MMCM or anything else. Loading. . Download the Device Packaging and Pinouts pdf user guide matching your device familiy (UG575 UltraScale Device Packaging and Pinouts for ultrascales. 7. This site uses cookies from us and our partners to make your browsing experience more efficient, relevant, convenient and personal. R evision His t ory. A user asks when version 1. 12) March 20, 2019 (I XILINXa Send Feed back UltraSc ale Device P ackaging and Pinouts 2. {"payload":{"allShortcutsEnabled":false,"fileTree":{"VCU128/docs":{"items":[{"name":"rdf0489-vcu128-bit-c-2019-1","path":"VCU128/docs/rdf0489-vcu128-bit-c-2019-1. PROGRAMMABLE LOGIC, I/O & BOOT/CONFIGURATION. File Size: 2MbKbytes. (XAPP1188) FPGA Configuration from SPI Flash Memory using a Microprocessor. 查看了UG575的 Soldering Guidelines ，是不是200°以上持续时间偏长（140s），要求是60–150s；且不应该是260度（文档上要求为FFVA1156，Mass reflow:245°）焊接引起的。UG575 adalah judi online terbaru dengan bonus deposit, extra bonus TO (TurnOver) bulanan, bonus happy hour, cashback mingguan, bonus rebate mingguan, freebet / freechip tanpa deposit, promo anti rungkat, bonus referral, bonus member baru, perfect attendant (absensi mingguan), deposit pulsa tanpa potongan, winrate tertinggi,. I'm using the KU060 in a relatively low power design. Hello. 6) August 26, 2019 11/24/2015 1. Expand Post Like Liked Unlike ReplyYes – sorta. But there is no PSG RN listed for this package in Figure 1-16 in UG575 (the one I attached above). However, during the Aurora IP customization I can only select: Starting Quad e. The similar Bank is the XCKU3P-SFVB784/FFVD900, too. "Quad X1 Y5". Ultrascale+ Packaging & Pinouts (UG575) tells me that there is in fact a Quad 231 on the right side of the device. 8. Best regards, Kshimizu . Also, when I try to create a bus with less than 2 bytes worth of bits, I see many LVDS pair hidden from the drop down. But what about the applied pressure on the lidless FPGA? We can read page 326 : "Xilinx recommends that the. Product Application Engineer Xilinx Technical Support要找一下 kintex-ultrascale系列器件的BANK 0 pin脚配置说明；请告知具体在哪一份文档？. Increased System. musthafavakeri (Member) 6 years ago **BEST SOLUTION** Hi All,XCKU060-2FFVA1517E soldering. Programmable Logic, I/O and Packaging. Integrating an Arm®-based system for advanced analytics and on-chip programmable. Download as Excel. Loading Application. Look at the Device Diagrams section of UG575 (Packaging and Pinouts) for your device. -----Expand Post. I wen through UG575 but couldnt find the I/O column and bank. Note: The zip file includes ASCII package files in TXT format and in CSV format. Kintex UltraScale, Kintex UltraScale+, and Artix UltraScale+ devices are. UG575 (v1. This chapter provides an overview of clocking and a comparison between clocking in the UltraScale architecture and previous FPGA. また、XCVU440 バンクに対して NativePkg. For example, Bank 68, 13-bit wide bus excludes the option to use A14/B14. 0) and UG575 (v1. UltraScale Architecture Configuration User Guide UG570 (v1. Those were working good and also the marking is very light and difficult to read ( Laser marking- I suppose) I am attaching the photo of the device. "X1 Y20". . Log In to Answer. Can you please suggest what is the recommended PCB pad size for them? Also, We are using via-in-pad structure. 18) April 22, 2022 Chapter 4: Mechanical Drawings UBVA368 Flip-Chip, Fine-Pitch BGA (XCAU10P and XCAU15P) X-Ref Target - Figure 4-1 Figure 4. You can refer to UG575 to check which ports can be used as GT's reference clock. Maximum achievable performance is device and package dependent; consult the associated data sheet for details. Many times I have purchased in open market. For the measurement conditions, refer to the JESD51-2 standard. 5M System Logic Cells leveraging 2 nd generation 3D IC. Let me know if you need any further details. (XAPP1282) 6. If you typed it in correctly and it's still not showing up, or you're not completely sure of the flight number, you should use the Flight. Up to 674 free user I/O for daughter board connection.